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High Thermally Conductive Gap Filler T-top81
High Thermally Conductive Gap Filler T-top81
FOB Price
Port
exwork
Packaging
bulk
Lead Time
2 weeks
Taiwan
Main Products : Thermal Conductive Pad/Gel/Grease/Sheet/Tape
No.435, Yongfeng Rd., Bade Dist.,
High Thermally Conductive Gap Filler T-top81 Introduce

LiPOLY T-top81

LiPOLY T-top81 is an ultra-soft, highly conformable,non-flammable interface material. T-top81 is a high deflectionmaterial, designed to allow minimal stress on components whileoffering excellent thermal conductivity and low thermalresistance. With a thermal conductivity of 8.0 W/m*K, T-top81offers excellent performance at an extremely competitive price.

Features

Thermal conductivity: 8.0 W/m*K

Highly conformable

Ultra-soft

High thermal conductivity

High deflection material

Non-flammable interface material.

It is excellent for filling small air gaps, making reliablecontact with heat source & sink

Applications

Between CPU and heat sink.

Between a component and heat sink.

Flat-panel displays

Power supplies

High-speed mass storage drives

Telecommunication hardware

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